The main products include KOKI welding materials, Zymet glue, cleaning agent, TIM materials.
Alloy Code | Characteristic | Sn | Ag | Cu | In | Bi | Ni | Co | Melting point (o C) | Powder diameter | Particle size（ μ M) |
S3X | Standard Edition | Reminder | 3.0 | 0.5 | 217-220 | Type3 Type4 Type5 Type6 | 20-45μm 20-38μm 10-25μm 5-20μm | ||||
SB6N | High reliability | Reminder | 3.5 | 6.0 | 0.5 | 202-210 | |||||
TB | Low-melting | Reminder | 58 | 138 | Type3 Type4 | 20-45μm 20-38μm | |||||
TAB | 1 | 57 | 138-140 | ||||||||
T4AB | 0.4 | 57.6 | 138-140 | ||||||||
S01XBIG | Low silver, anti-corrosion | Reminder | 0.1 | 0.7 | 1.6 | + | 211-227 | ||||
S1XBIG | 1.1 | 0.7 | 1.8 | + | 211-223 |
Types | Model | Characteristic |
Halogen-free | S3X48/58-M500 series | ? Stable printing performance for 0.4mm pitch QFP and 0.30mm φ CSP components ? Ensures excellent wettability on 0.4mm pitch QFP, 0.30mm φ CSP, and 0603 metric components ? Halogen-Free solder paste (Cl + Br: < 1500ppm) ? Reduced voiding achieved through innovative additive technology ? Enhanced heat resistance to prevent head-in-pillow (HIP) defects ? Enables continuous stencil printing and minimizes solder paste material waste |
Halogen-free | S3X58-M650 series | ? Fully Halogen-Free: Compliant with BS EN14582 standard (F, Cl, Br, I = 0ppm) ? Specialized Flux Formulation: Developed specifically for superior ICT testability ? Exceptional Low Voiding: Achieved through meticulously selected flux composition ? Complete Melting & Perfect Wetting: Ensures optimal solder joint formation ? Outstanding Performance on Micro Features: Delivers reliable results on micro pads (<0.4mm pitch) and miniature components (<0.25mm dia. CSP, 0603 metric chip) |
Double-sided process | S3X58-A340 | ? Excellent Wettability on Micro Features: Ensures superior solderability for 0603 metric components and 0.25mm φ CSP pads. ? Maintains Initial Printability: Consistent performance after 30-minute printing interruptions. ? Extended Stencil Life: Sustains print quality through over 200 consecutive stencil wipes. ? Optimized for Double-Sided Assembly: Features an ideal rosin-based flux composition providing strong component tack force. |
High reliability | SB6N/X58-M500SI SB6N58-A730-3 | ? Enhanced Crack Resistance: Indium-enriched alloy formulation mitigates thermal stress and prevents solder joint cracking. ? Minimized Thermal Deformation: Maintains reliability in demanding harsh-environment applications through low CTE (Coefficient of Thermal Expansion). ? High-Precision Printing Performance: Superior continuous printability for ultra-fine pitch components (0.4mm/16mil) and CSPs (>0.3mm diameter), supporting wide printing speeds (20–80mm/sec) and extended stencil idle time. ? Halogen-Free Compliance: Meets BS EN14582 standard (Cl+Br: 0ppm). |
Low cost and high reliability | S01XBIG58-M500-4/B S1XBIG58-M500-4/B | ? Enhanced Reliability: Next-generation low-silver alloys outperform traditional SAC305 formulations in mechanical durability. ? Superior Micro-Joint Formation: Ensures complete melting and perfect wetting on ultra-fine-pitch components (>0.25mm CSP, 0603 metric chips). ? SAC305 Process Compatibility: Low melting point enables use in standard reflow profiles without process adjustments. ? Halogen-Free Compliance: Meets EN14582 standard (Cl+Br < 1500ppm). |
Low-melting | TB/TAB/T4AB48/58-M742 | ? Ultra-Low Melt & Perfect Wetting: Achieves complete melting at 138°C with superior wetting performance. ? Precision Micro-Feature Compatibility: Engineered for ultra-fine-pitch components (<0.4mm) and miniature packages (>0.3mm CSP, 0603 metric chips). |
Spot tin | S3X811-E150DN | ? Jet Dispensing Optimized: Precision-formulated solder paste for advanced jet dispensing systems. ? Multi-Nozzle Compatibility & Control: Works with various jetting heads while maintaining accurate dot volume control. ? Halogen-Free Certified: Complies with BS EN14582 standard (Br+Cl < 1500ppm). |
Address：Room 804, No. 200. Xinghai Rd, Suzhou City, Jiangsu Province, China
Phone：0512-62567570
0512-62567686
Email：solder@dingshengsz.com
